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Green energy
Vehicle gauge SiC
wafer level reliability test
Necessity of wafer reliability test in vehicle specification SiC chip:According to the bathtub curve theory, any electronic component will have a high failure rate at the beginning of its life cycle, and the failure rate will obviously drop to the
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CP Test Wafer loading Wafer burn-in Wafer unloading KGD Test
AccoTEST STS8200 Nexustest AL3500A Nexustest WLR3500 Nexustest AL3500A Nexustest PB6600

DC

EAS/UIS

Ciss/Coss/Crss/Rg

Wafers are automatically loaded from cassettes to probe card assemblies

HTRB

HTGB

Vth

Support for 6 wafers

Automatic wafer unloading from probe card assembly to jam

DC

EAS/UIS

Ciss/Coss/Crss/Rg

Short

Double Pulse

Recovery
New requirements for vehicle specification level power chip testing
Unlike consumer grade products, cars will operate in harsh environments such as outdoor, high temperature, cold and humid, and the design life is generally 15 years or 200000 kilometers.
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  • Wafer Fabrication

  • Wafer Process

  • WAT

  • Wafer Certify
    BI

  • Wafer Certify
    BI

  • CP

  • Assembly &
    Test

  • Wafer
    BI

  • Dicing

  • KGD

  • Asse.
    Process

  • FT

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